Bacillus cereus is more heat resistant than Aspergillus niger due to its ability to form endospores that help protect it from extreme conditions, including heat. These endospores act as a protective structure that allows the bacterium to survive in harsh environments. Aspergillus niger, on the other hand, does not form endospores and therefore is not as heat resistant.
Aerobic and anaerobic bacterial spore formers have specialized structures called endospores that protect their genetic material from harsh conditions like heat. These endospores are highly resistant to heat, making the bacteria more heat-resistant overall. In contrast, the tubercle bacillus (Mycobacterium tuberculosis) lacks such protective structures, making it less heat-resistant than spore-forming bacteria.
Microorganisms have different heat resistance levels due to variations in their genetic makeup. Some microorganisms have developed heat-resistant structures or proteins that protect them from high temperatures. Additionally, certain microorganisms may produce spores or biofilms that provide protection during exposure to heat.
Ordinary glass can be made heat-resistant by adding certain compounds such as boron or alumina during the manufacturing process. These compounds help to strengthen the molecular structure of the glass, making it more resistant to thermal shock. Additionally, the glass can be treated with a special coating or undergo a tempering process to enhance its heat resistance.
HR means heat resistant - if if find any more info ill post
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No, this statement is inaccurate. The higher the R-value of insulation, the more resistant it is to heat flow. R-value measures the effectiveness of insulation in resisting heat transfer, with higher values indicating better insulation properties.
Steel is inherently more flame resistant.
It can be. The grain is called grog, and it helps make the fired clay stronger and more resistant heat stress.
because u structure has more - between carbono
Tungsten is the most heat-resistant element, with a melting point of 3,422°C (6,192°F). It is commonly used in high-temperature applications such as light bulb filaments and furnace components.
More than 20,000 tiles fit on a space shuttle.