this process involves following major steps... 1. Wafer preparation 2. Epitaxial growth 3. Oxidisation 4. Photolithographic process 5. Isolation diffusion 6. Base and emitter diffusion 7. Pre-ohmic etch 8. Metallisation 9. circuit probing 10. Scribing and separating into chips 11. Mounting and packing 12. Encapsulation (NOTE;- These are the processes involved for monolithic ic's. Detailed information can be found on internet.)
Answer The MC1458 is a high-performance operational amplifier with highopen-loop gain, internal compensation, high common-mode rangeand exceptional temperature stability. The MC1458 is short-circuitprotected. The MC1458/SA1458/MC1558 consists of a pair of 741 operationalamplifiers on a single chip.
What is pin configuration of IC CD4017?Pin numberNamePurpose16The 6th sequential output22The 2nd sequential output31The 1st sequential output43The 3rd sequential output57The 7th sequential output68The 8th sequential output74The 4th sequential output80V, VDDThe connection to the 0V rail99The 9th sequential output105The 5th sequential output1110The 10th sequential output12COCarry out output - outputs high on counts 0 to 4, outputs low on counts 5 to 9 (thus a transition from low to high occurs when counting from 9 back to 0)13LELatch enable - latches on the current output when high (i.e. the chip counts when LE is low)14CLKClock in15RSTReset - sets output 1 high and outputs 2 through 10 low, when taken high16+9V, VCCThe connection to the +VCC rail (voltage between +3V and +15V)
no, the 741 opamp is a monolithic IC.
this process involves following major steps... 1. Wafer preparation 2. Epitaxial growth 3. Oxidisation 4. Photolithographic process 5. Isolation diffusion 6. Base and emitter diffusion 7. Pre-ohmic etch 8. Metallisation 9. circuit probing 10. Scribing and separating into chips 11. Mounting and packing 12. Encapsulation (NOTE;- These are the processes involved for monolithic ic's. Detailed information can be found on internet.)
An IC or integrated circuit consists of a chip ("die") and plastic or ceramic packaging to protect the die from mechanical and (some) electrical damage. An IC with more than one die is usually called a "hybrid" IC. A "monolithic" IC is just a plain old one-die IC, but it implies that functions from a number of ICs have been incorporated into that one IC. One form of monolithic IC is where the functions of a powerful graphics processor is put on the same die as a CPU. An SOC ("System On a Chip") is another trend in monolithic ICs. "Monolithic" is something of a transitional term. Floating point, memory management, and processing units all used to to be on separate ICs. Now they are all on the same IC, but we don't call them "monolithic" any more.
linear monolithic
LM stands for "Linear Monolithic"
low cost high reliability
Vacuum sublimation
It's a prefix of the IC products of 'Linear Monolithic' category of National semiconductors.
Metallization is a technique used to form metal contacts and interconnects in the fabrication of ICs.
LM stand for Liner Monolithic ic that is the National Instrunt perfix, I My right
Full form of LM in any IC like LM317 is linear monolithic
VLSI deals with fabrication of an IC (integrated circuit) or a chip. The design and fabrication of an IC is vital in prototyping any system. In order to implement any application, the basic requirement is an IC. Hence, VLSI which is used to fabricate bulk number of ICs is becoming popular.