A SIP (single inline package) is a semiconductor chip (monolith) that has one row of pins a DIP (dual inline package) is a semiconductor chip (monolith) that has two rows of pins
RIMM: Rambhous Inline Memory ModuleSIMM: Single Inline Memory ModuleDIMM: Dual Inline Memory ModuleDDRDIMM: Dual Data Rate Dual Inline Memory Module
RIMM: Rambhous Inline Memory ModuleSIMM: Single Inline Memory ModuleDIMM: Dual Inline Memory ModuleDDRDIMM: Dual Data Rate Dual Inline Memory Module
dual inline package (DIP) switch -jazzmarazz13
Dual inline package (DIP) switch
A unit with several small rocker-type switches that plugs into a dual in-line package (DIP) on a printed circuit board.
The dual inline package chip (DIP) consists of anything the chip maker wants to provide, ranging from simple logic to entire microprocessors. The DIP terminology is used to describe the physical pin layout, not the contents or the fabrication of the chip. Typically the pins are arranged in two rows, separated by either 0.3 inches or 0.6 inches, with each pin 0.1 inches apart.
dual inline memory module
The package you are talking about is called a Dual Inline Package (DIP), but this package has been (and still is) used for many other chips than just memory chips. Modern memory modules are often packaged in a Dual Inline Module (DIM), a small printed circuit board with contacts on both sides and several Flat-Pack or Surface Mount memory chips soldered to the board. There are many packages that have been used in the past and/or are now being used in the present for memory chips.
DIP stands for Dual Inline Package. Most often, the pins are on 0.1 inch centers, with two rows of pins that are either on 0.3 inch centers or 0.6 inch centers.
DIMM- DUAL INLINE MEMORY MODULE RIMM - RAMBUS INLINE MEMORY MODULE SIMM SINGLE INLINE MEMORY MODULE
SIMM (Single inline memory module), DIMM (Dual inline memory module), and RIMM (Rambus inline memory module)