What does the dual inline package chip consist of?
The dual inline package chip (DIP) consists of anything the chip
maker wants to provide, ranging from simple logic to entire
microprocessors.
The DIP terminology is used to describe the physical pin layout,
not the contents or the fabrication of the chip. Typically the pins
are arranged in two rows, separated by either 0.3 inches or 0.6
inches, with each pin 0.1 inches apart.